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采用红外光谱分析仪和热重分析仪对聚酰亚胺树脂的结构和性能进行分析,结果表明该树脂具有与聚酰亚胺相类似的结构及优良的耐热性能。聚酰亚胺纤维原纸在不同树脂溶液中浸渍后表明,当聚酰亚胺树脂浸渍液浓度为4%时,纸张具有较好的强度性能和电气性能。
The structure and properties of the polyimide resin were analyzed by FTIR and TGA. The results showed that the resin has a similar structure and excellent heat resistance. Polyimide fiber base paper impregnated in different resin solutions showed that when the polyimide resin impregnation solution concentration of 4%, the paper has good strength and electrical properties.