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液相脉冲激光烧蚀法(PLAL)具有绿色环保、适用范围广及可制备复合材料等优点,受到学术界的广泛关注,但是较低的制备效率限制了它进一步发展。将微流控技术与液相脉冲激光烧蚀法相结合,在硅基微流控芯片中实现了快速高效制备晶格型(400~800nm)和球型(100~300nm)硅纳米结构。通过扫描电子显微镜和光谱仪对其形貌结构及分布情况进行了测试表征,获得了微流控流速、激光烧蚀功率与纳米粒子制备效率之间的关系。该方法将液相脉冲激光烧蚀法的最高制备效率提高了30%以上,达到87.5mg/min,为将来液相脉冲激光烧蚀法工业化生产提供一种新的技术路线。
Liquid-phase pulsed laser ablation (PLAL) has the advantages of green environmental protection, wide range of application, and can be used for the preparation of composite materials. It has drawn wide attention of the academic circles, but the lower preparation efficiency limits its further development. The combination of microfluidic technique and liquid-phase pulse laser ablation method has enabled the rapid and efficient preparation of crystalline silicon (400-800nm) and spherical (100-300nm) silicon nanostructures in silicon-based microfluidic chips. The morphologies and distributions of the nanoparticles were characterized by scanning electron microscopy and spectroscopy. The relationship between microfluidic flow rate, laser ablation power and nanoparticle preparation efficiency was obtained. The method increases the maximum preparation efficiency of the liquid phase pulse laser ablation method by more than 30% to 87.5mg / min, and provides a new technical route for the industrialized production of the liquid phase pulse laser ablation method in the future.