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一、概述随着电子工业的发展,对印制线路板提出了新的要求,基本是:1.线路板上线条越来越精细、紧密;2.电镀铅锡合金以获得良好的可焊性及三防性能,以免浸银镀层太薄,日久易变黄发黑,可焊性变差,可能产生银离子迁移引起精细线间短路的缺点;3.双面板进行孔金属化以确保线路板的高质量,增加整机或仪器仪表的可靠性。为达到上述要求,可以采用多种途径和方法。过去,我们用工艺导线法制双面孔化
First, an overview With the development of the electronics industry, the printed circuit board put forward new requirements, the basic is: 1, the circuit board more and more fine lines, close; 2 electroplating pewter to obtain good solderability And three anti-performance, so as not to be immersed in silver coating is too thin, yellowish black over time, darkening, poor weldability, silver ion migration may cause shortcomings between the fine lines shortcomings; 3. Double-sided metallization to ensure the line The high quality of the board increases the reliability of the complete machine or instrumentation. To achieve the above requirements, a variety of ways and means can be used. In the past, we used double-sided perforation of technology lines