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以E-51环氧树脂、正硅酸乙酯、钛酸正丁酯为原料,采用溶胶-凝胶法制备硅钛杂化环氧树脂,利用IR光谱对硅钛杂化环氧树脂的结构进行表征。研究了不同硅钛含量杂化环氧/聚酰胺固化体系的粘接性能、冲击强度和耐水煮性能;利用DSC、DMA、TG研究了硅钛含量对硅钛/环氧/聚酰胺固化体系固化反应温度、储能模量、玻璃化温度、热失重温度影响;利用扫描电镜对硅钛/环氧树脂/聚酰胺固化物断口的微观形貌进行了分析。结果表明:硅钛含量为0.55~1.09phr/100g Ep时,硅钛/环氧树脂/聚酰胺体系综合性能较好,硅钛/环氧固化体系具有较高粘接强度、冲击强度、模量、热分解温度、耐水煮性能。
E-51 epoxy resin, tetraethyl orthosilicate and n-butyl titanate were used as raw materials to prepare the titanosilicate hybrid epoxy resin by sol-gel method. The structure of the titanosilicate hybrid epoxy resin Characterization. The adhesive properties, impact strength and boiling resistance of different Si / Ti hybrid epoxy / polyamide cured systems were studied. The effects of Si / Ti content on the cure rate of Si / Ti / PA / Cu system were studied by DSC, DMA and TG. Reaction temperature, storage modulus, glass transition temperature and weight loss temperature. The microstructure of the fracture surface of Si / Ti / polyamide cured by SEM was analyzed. The results show that the Si-Ti / epoxy / polyamide system has better overall properties when the content of Si and Ti is 0.55-1.09phr / 100g Ep. The Si-Ti / epoxy curing system has higher bonding strength, , Thermal decomposition temperature, resistance to boiling performance.