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目的针对以往载人航天应用系统中电子设备热设计的仿真分析方法不准确的问题,提出一种基于热平衡试验测量发热元器件温度数据验证热仿真分析结果的电子设备热设计方法。方法通过对应用系统电子设备在轨实际热工况条件的深入分析,结合电子设备的物理特性、电气特性及其技术特点,利用计算机应用技术和数字仿真技术建立电子设备热模型,并进行热仿真分析,再将仿真计算得到的发热元器件壳温与实际热平衡试验测量得到的元器件真实壳温比对,检验热仿真分析结果的准确性。结果某电子设备在真空度为1.0×10~(-4) Pa,温度为45℃条件下开展热平衡试验,实测得到的发热元器件温度值与热仿真分析温度值之差小于1℃。热平衡试验过程中,切换电子设备的不同工作模式时,通过器件的工作电流和电压计算出其热负荷指标与仿真得到的热耗值之差低于0.1 W。结论基于热平衡试验的发热元器件实测温度数据,验证了热仿真分析结果的电子设备热设计方法科学有效,有助于后续空间站应用系统电子设备热设计工作。
Aiming at the problem of inaccurate simulation analysis of electronic equipment thermal design in manned space applications, a thermal design method of electronic equipment based on thermal equilibrium test is presented to verify the thermal simulation results. Methods Based on the in-depth analysis of actual thermal conditions of on-orbit of electronic equipment in the system and the combination of the physical and electrical characteristics of electronic equipment and its technical features, the thermal model of electronic equipment is established by using computer application technology and digital simulation technology, and the thermal simulation Analysis, and then calculated by the simulation of the heating element shell temperature and the actual heat balance test measured the true shell temperature ratio of components to verify the accuracy of thermal simulation results. Results The heat balance test was conducted under the condition of a vacuum degree of 1.0 × 10 -4 Pa and a temperature of 45 ℃. The difference between the measured temperature of the heating element and the temperature of the thermal simulation analysis was less than 1 ℃. During the heat balance test, the difference between the heat load index and the simulation heat dissipation value calculated by the working current and voltage of the device when the different working modes of the electronic device are switched is lower than 0.1W. Conclusions Based on the measured temperature data of the heat balance device, the thermal design method of the electronic device that verified the thermal simulation results is scientific and effective, which is helpful for the thermal design of the electronic device of the subsequent space station application system.