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红外焦平面读出电路(IRFPA ROIC)主要用于焦平面阵列与后续信号处理之间的通信。文章提出了一种用于红外焦平面读出电路的缓冲器模块,包括列缓冲器、高性能的输出缓冲器以及相应的偏置电路。缓冲器均采用单位增益放大器结构,通过放大器的优化设计可实现对不同负载的有效驱动且静态功耗较低。该缓冲器模块用于一款640×512面阵、30μm中心距的中波红外焦平面读出电路,采用CSMC 0.5μm DPTM工艺进行流片加工。仿真结果表明,列缓冲器的开环增益为40.00dB,单位增益带宽为48.17MHz(10pF)。输出缓冲器可实现轨到轨的输入,开环增益为39.68dB,单位增益带宽为46.08 MHz,读出速率高达20 MHz,功耗为16.02 mW(25pF∥5.1kΩ)。该模块输入端拉出的测试管脚可在焦平面读出电路的晶圆测试中帮助验证芯片功能。通过调节测试端口,测试结果与仿真结果大体一致,验证了该缓冲器模块的设计可行。
Infrared focal plane readout circuit (IRFPA ROIC) is mainly used for the communication between the focal plane array and subsequent signal processing. This paper presents a buffer module for infrared focal plane readout circuit, including a column buffer, a high performance output buffer and a corresponding bias circuit. The buffer adopts the unit gain amplifier structure, through the amplifier’s optimized design, it can effectively drive different loads and has lower static power consumption. The buffer module for a 640 × 512 area array, 30μm center distance of the infrared focal plane readout circuit using CSMC 0.5μm DPTM process for film processing. The simulation results show that the open-loop gain of the column buffer is 40.00dB and the unit gain bandwidth is 48.17MHz (10pF). The output buffer enables rail-to-rail input with an open loop gain of 39.68dB, a unity gain bandwidth of 46.08 MHz, read rates up to 20 MHz and power dissipation of 16.02 mW (25pF // 5.1kΩ). Test pins pulled out of the module inputs help verify chip functions during wafer testing of focal plane readout circuitry. By adjusting the test port, the test results are generally in agreement with the simulation results, which verifies that the design of the buffer module is feasible.