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对定向凝固结合电子束制备5N高纯铜进行了研究。首先采用真空感应熔炼4N(99.99%)阴极铜并进行定向凝固实验,然后利用电子束对定向凝固后的铸锭进行重熔精炼,利用辉光放电质谱仪进行成分分析。实验结果表明:真空熔炼可以有效去除铜中饱和蒸气压高的杂质;通过定向凝固,杂质元素含量沿铸锭轴向逐渐升高;经过组合工艺提纯后,总杂质含量由13.6×10-6降低至4.0×10-6,铜的纯度提高至99.9996%。
The preparation of 5N high purity copper by directional solidification combined with electron beam was studied. Firstly, 4N (99.99%) copper cathodes were melted by vacuum induction and subjected to directional solidification experiment. Then the ingot after directional solidification was remelted and refined by electron beam, and composition analysis was conducted by glow discharge mass spectrometry. The experimental results show that vacuum melting can effectively remove impurities with high saturated vapor pressure in copper. By directional solidification, the content of impurity elements gradually increases along the axial direction of the ingot. After the combination process, the total impurity content decreases from 13.6 × 10-6 To 4.0 × 10 -6, the purity of copper is increased to 99.9996%.