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分析了工业级和宇航级FPGA(Field Programmable Gate Array)在封装结构上的差别。用Ansysworkbench有限元软件对热循环、随机振动和外力载荷下封装的变形和应力以及焊点的塑性应变进行了仿真。依据剪切塑性应变变化范围预测了焊点热疲劳寿命。结果表明,FCBGA(Flip-Chip Ball Grid Array)封装内部倒装芯片焊点可靠性低于CCGA(Ceramic Column Grid Array)封装,其外部焊点的热疲劳寿命、随机振动等效应力均优于CCGA封装;在外力载荷下,其热疲劳寿命下降速率也明显小于CCGA封装。
The differences between the package structure of industrial level and space programmable gate array (FPGA) are analyzed. The finite element software Ansysworkbench was used to simulate the deformation and stress of the package under cyclic loading, random vibration and external load and the plastic strain of the solder joints. The thermal fatigue life of solder joint is predicted based on the range of shear plastic strain. The results show that the reliability of flip-chip solder joints in FCBGA package is lower than that of CCGA (Ceramic Column Grid Array) package. The thermal fatigue life and random vibration equivalent stress of external solder joints are better than CCGA Package; under the external load, the thermal fatigue life rate of decline is also significantly smaller than the CCGA package.