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提出了一种操作方便、性能可靠的光纤Bragg光栅(FBG)传感器高温固化封装工艺。实验中,采用预应力施加装置对FBG施加轴向预应力,用高温固化剂将FBG固化封装于弹性衬底材料表面。测试结果表明,施加预应力高温固化封装的8个FBG传感器线性度均在0.999以上;波形无啁啾现象,对温度的响应灵敏度系数平均为2.05×10-5/℃,测试值与理论值的平均偏差为0.04×10-5/℃,粘贴后的应变传递耦合系数η≈1。本文封装工艺可实现对FBG传感器性能指标的有效控制,对FBG传感器的普遍推广有重要的应用价值。
A high-temperature curing packaging technology of fiber Bragg grating (FBG) sensor with convenient operation and reliable performance was proposed. In the experiment, the prestressing device was used to apply axial prestress to the FBG, and the FBG was cured and encapsulated on the surface of the elastic substrate by the high temperature curing agent. The test results show that the linearity of the eight FBG sensors with pre-stress high-temperature curing encapsulation are all above 0.999. The chirp of the waveform is unobtrusive and the average response sensitivity to temperature is 2.05 × 10-5 / ℃. The measured value is in agreement with the theoretical value The average deviation is 0.04 × 10-5 / ℃, and the strain transfer coupling coefficient η≈1 after pasting. The packaging process of the present invention can effectively control the performance index of the FBG sensor and has important application value for the general promotion of the FBG sensor.