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利用多物理场有限元软件COMSOL Multiphysics3.5(a)对多晶硅定向凝固过程进行数值模拟,获得了定向凝固过程中加热熔化和结晶过程的温度场分布。通过对模拟结果的分析,得到了多晶硅熔化过程温度分布和结晶时固液界面形状,为后续生产实践中工艺方案的优化及缺陷分析等提供重要的理论依据。
The multi-physics finite element software COMSOL Multiphysics 3.5 (a) was used to simulate the directional solidification of polycrystalline silicon. The temperature field distribution during the process of directional solidification was obtained. Through the analysis of the simulation results, the temperature distribution of the polysilicon melting process and the shape of the solid-liquid interface during the crystallization are obtained, which provides an important theoretical basis for the optimization of the process plan and defect analysis in the subsequent production practice.