电子元器件的塑料封装与传统的陶瓷、金属材料相比,具有封装工艺简单、成本低、体积小、重量轻、可靠性好等优点,已成为当今器件封装的主流.约有80%的集成电路,90%以上的分立器件采用塑料封装.在各类塑料中,环氧模塑料几经改进,不但成本低、 Compared with the traditional ceramic and metal materials, the plastic packaging of electronic components has become the mainstream of the device packaging today because of the advantages of simple packaging process, low cost, small size, light weight, good reliability, etc. About 80% of the integrated Circuit, more than 90% of the discrete devices using plastic package in all types of plastics, epoxy molding compound after several improvements, not only low cost,