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酚醛树脂-重氮萘醌型正性光致抗蚀剂主要适用于436nm(G线)~365nm(I线)的紫外曝光区域,是目前电子和PS版工业中使用最多的正性抗蚀材料。本文介绍了近年来该类抗蚀剂的国内外进展情况,并对其各个组分进行了归纳综述。
Phenolic resin - diazonaphthoquinone positive photoresist is mainly applied to the UV exposure area of 436nm (G line) ~ 365nm (I line), is the most commonly used positive resist material in the electronics and PS industry . In this paper, the progress of these kinds of resists in recent years at home and abroad is introduced, and their components are summarized.