论文部分内容阅读
针对锡铋焊膏形成焊点表面发黑问题以及回流过程中出现的黑色物质,通过扫描电子显微镜、能谱分析、X射线晶体衍射等方法,采用焊点表面黑色残留物直接测试以及高温下提取黑色物质测试两种方法进行分析。结果证明,焊点表面发黑的原因与元素Bi有关,并根据焊点形成条件的不同生成单质铋或铋的氧化物。
In order to solve the problem of black spots on the surface of solder joint and the black material appeared during the reflow process, tin-bismuth solder paste was tested by scanning electron microscopy, energy dispersive spectroscopy and X-ray diffraction. The black residues on the solder joint surface were directly tested and extracted at high temperature Black substance test two methods for analysis. The results show that the black spot on the surface of the element is related to the element Bi, and according to the formation of solder joints according to the different conditions of the elemental bismuth or bismuth oxide.