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利用红外热成像技术可以对印刷电路板（ＰＣＢ）进行有效的非接触测试。在建立ＰＣＢ的标准热像（ＳＩＰ）后，通过计算机快速自动地比较分析被测板（ＵＵＴ）热像和从存贮器中取得的该板的ＳＴＰ，从而检测出ＰＣＢ上的热模式故障。本文介绍了总后“八．五”重点项目“ＰＣＢ故障红外诊断仪”（以下简称诊断仪）的组成、原理、结构及开发时应注意的一些问题。
Infrared thermography enables effective non-contact testing of printed circuit boards (PCBs). After establishing the standard thermal image (SIP) of the PCB, the thermal mode failure on the PCB is detected by a computer automatically comparing thermal images of the UUT and the STP of the plate obtained from the memory quickly and automatically. This article describes the composition, principle, structure and some issues that should be noticed when developing the “PCB Fault Infrared Diagnostic Instrument” (hereinafter referred to as “Diagnostic Instrument”