论文部分内容阅读
伴随着现代微电子技术的高速发展,在一些特殊环境条件下使用的各种微波模块,需要进行密封封装,以防止器件中的电路因潮气、大气中的离子、腐蚀气氛的浸蚀等引起失效,采用气密性封装以延长器件的使用时间。密封的实现方式根据具体要求采取不同的措施,对于密封要求相对较低,可以采用锡封的方式实现;对于密封要求相对较高的,可以采用平行封焊的方式实现。影响平行缝焊质量的有诸多因素,盖板与平行缝焊的关系是相当重要的,在壳体性能稳定的情况下,盖板质量的好坏直接影响着器件的气密性,盖板和管壳之间的匹配、工艺参数的设置、电极表面的状态等对平行缝焊的质量都起着重要的作用。
With the rapid development of modern microelectronic technology, various microwave modules used under special environmental conditions need to be encapsulated in a sealed manner to prevent the circuits in the device from failing due to moisture, atmospheric ions and corrosion of the atmosphere , Airtight package to extend the device’s use of time. The implementation of the seal according to the specific requirements to take different measures for the sealing requirements are relatively low, tin seal can be used to achieve; for sealing relatively high, can be used to achieve parallel seal. There are many factors that affect the quality of parallel seam welding. The relationship between cover and parallel seam welding is quite important. In the case of stable performance, the quality of the cover directly affects the airtightness of the device. Match between the tube shell, the setting of process parameters, the state of the electrode surface on the quality of parallel seam welding plays an important role.