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在 IC 硅片加工工艺中,薄膜工艺,如氧化,低压或等离子体 CVD 淀积等是十分重要。随着器件的 CD 尺寸缩小,如何保证生长薄膜的重复性及均匀性,给操作者提出了更高要求。本文将介绍一种在 IC 流水线生产中实用的,非破坏性薄膜厚度测试仪。美国 Nanomet-rics 公司生产,型号 Nanospec/AFT,价格在4.5万美元左右。传统的薄膜厚度测试采用椭园仪,国内许多单位都引进了美国应用材料公司的 Reflect-ometer Ⅱ型。但是,在实际 IC 生产过程中,使用椭园仪有如下不便:通常情况下,椭园仪只能测定单层薄膜厚度。所以流水线上的硅片无法测定,需要有
In IC wafer processing, thin film processes, such as oxidation, low pressure or plasma CVD deposition, are important. As the CD size of the device shrinks, how to ensure the repeatability and uniformity of the growth film gives the operator higher requirements. This article describes a practical, non-destructive film thickness tester for IC assembly line production. The United States Nanomet-rics company production, model Nanospec / AFT, the price of 45,000 US dollars. The traditional film thickness test using the elliptical instrument, many domestic units have introduced the United States Applied Materials Reflect-ometer Ⅱ type. However, in the actual IC production process, the use of elliptical device has the following inconveniences: In general, the elliptical device can only measure the thickness of a single layer of film. Therefore, the pipeline can not be determined on the silicon, you need to have