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DEM技术 (Deepetching ,ElectroformingandMicroreplication )是继硅微加工技术和LIGA技术发展起来的一种全新的非硅三维微加工技术。该技术吸收了体硅微加工技术和LIGA技术的部分工艺 ,可对非硅材料进行三维微加工。目前利用该技术已获得了微复制模具 ,并已模压出多种高深宽比塑料微结构。该技术的开发成功 ,为微机电系统的产业化奠定了基础。
DEM technology (Deepetching, Electroforming and Microreplication) is a new non-silicon three-dimensional micro-machining technology developed after silicon micro-machining technology and LIGA technology. The technology incorporates bulk silicon micro-machining technology and LIGA technology part of the process, non-silicon materials for three-dimensional micro-machining. Micro-replicating dies have now been obtained using this technique and a number of high aspect ratio plastic microstructures have been molded. The successful development of this technology has laid the foundation for the industrialization of MEMS.