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A New Activation Method for Electroless Metal Plating：Palladium Laden via Bonding with Self—Assembly
[期刊论文] 作者：LiNaXU,JianHuiLIAO,等,
来源：中国化学快报：英文版 年份：2002
A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensit...
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