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提出了一种全新的亚微米级温度传感器的构想。作者在借鉴AFM悬臂测头的基础上，采用了微机械加工技术中的各向同性和各向异性腐蚀技术，在硅材料上完成了悬臂梁与硅尖制作。制成的梁的厚度在6μm左右、尖端曲径半径远小于1μm。随后对悬臂梁前端的硅尖进行尖端放电，隧穿其顶端的Si_3N_4层形成温敏器件──一个微型的热电偶。最后进行了这一温敏传感器的引线和封装。由于制作所形成的硅尖曲径半径在0．1μm左右，从而可以在其尖顶上形成亚微米级的温度传感器，在集成电路的探伤与修补以及生物技术领域，有着广阔的应用前景。
Proposed a new concept of sub-micron temperature sensor. Based on the AFM cantilever probe, the author adopts isotropic and anisotropic etching techniques in micromachining technology to fabricate cantilever and silicon tip on silicon material. Beam made of about 6μm in thickness, tip radius of much less than 1μm. The tip of the cantilever tip is then tip-discharged, tunneling the top Si_3N_4 layer to form a temperature-sensitive device - a miniature thermocouple. Finally, the temperature sensor of the lead and package. Since the diameter of the silicon tip formed by the fabrication is about 0.1 μm, a submicron temperature sensor can be formed on the apex of the spike, which has broad application prospects in the field of testing and repair of integrated circuits and biotechnology.