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为满足日益增长的移动资料需求,第三代合作伙伴计划(3GPP)长程演进计划(LTE)标准已演进至LTE-Advanced,因而也为高能源效率移动元件设计工程师带来新的挑战。因此,嵌入式处理器、硅知识产权(IP)供货商ARM与嵌入式数字信号处理器(DSP)内核的供货商CEVA合作提出分析报告,共同探讨实现下一代移动无线宽带设备所须考虑的设计因素。本文首先将探讨3GPP第十版标准(亦即LTEAdvanced),在输送量限制、低延迟以及低功耗方面的具体设计挑战;而后,将检视系统级设计,例如节能模式、除错和追踪,以及多模式操作的支持。
To meet the growing demand for mobile data, the 3rd Generation Partnership Project (3GPP) Long-Range Evolution (LTE) standards have evolved to LTE-Advanced and have also posed new challenges for high-energy-efficiency mobile component design engineers. As a result, embedded processors, silicon intellectual property (IP) supplier ARM, and CEVA, an embedded digital signal processor (DSP) core, have teamed up to provide an analysis report to consider the next generation of mobile wireless broadband devices to consider The design factor. This article will first explore the specific design challenges of 3GPP 10th Edition (LTE Advanced) with respect to throughput limitations, low latency, and low power consumption. Later, system-level designs such as power-saving modes, debug and tracing, Multi-mode operation support.