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在真空钼丝电阻炉中制备了TC4/ZL105复合材料,利用光学显微镜(OM)、扫描电子显微镜(SEM)和能谱仪(EDS)对过渡层的组织和成分进行了表征,并对过渡层显微硬度进行了测试。结果表明,当温度为700℃保温60 min时,TC4/ZL105复合材料中间过渡层的厚度适中,组织相对致密,缺陷较少。TC4/ZL105复合材料过渡层中靠近钛侧组织致密,为α-Ti固溶体;靠近铝侧组织疏松,主要由TiAl_3和TiSi_2共晶相组成,且显微硬度均高于母材;结合区的显微硬度随着连接温度的升高而增加,峰值硬度达643 HV。
The TC4 / ZL105 composite was prepared in a vacuum molybdenum wire resistance furnace. The microstructure and composition of the transition layer were characterized by optical microscope (OM), scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS) Microhardness was tested. The results show that when the temperature is 700 ℃ for 60 min, the thickness of intermediate layer of TC4 / ZL105 composite is moderate, the microstructure is relatively dense and the defects are few. The microstructure of TC4 / ZL105 composite layer is dense and α-Ti solid solution close to the titanium side. The microstructure of the TC4 / ZL105 composite layer is mainly composed of TiAl_3 and TiSi_2 eutectic phases, and the microhardness is higher than that of the parent metal. Microhardness increases with increasing connection temperature, with a peak hardness of 643 HV.