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对键合互连对微波多芯片组件的相位特性影响进行了理论分析,并通过仿真软件HFSS对金丝键合互连模型进行了仿真。给出了在8~18 GHz的频率范围内,由于金丝拱高和跨距装配误差带来的相位误差。仿真分析表明,当金丝跨距在0.4~0.8 mm范围内波动时,最大相位差值在11 GHz以上时会超过20°,而当拱高在0.1~0.4 mm范围内波动时,最大相位差值在10 GHz以上时会超过20°,在13 GHz以上频率会超过30°。
The influence of bond interconnection on the phase characteristics of microwave multi-chip module is analyzed theoretically, and the gold wire bonding interconnection model is simulated by simulation software HFSS. The phase error due to the assembly error of the gold arch height and span is given in the frequency range of 8-18 GHz. The simulation results show that the maximum phase difference exceeds 20 ° when the gold span fluctuates from 0.4 to 0.8 mm and the maximum phase difference fluctuates from 0.1 to 0.4 mm when the arch height fluctuates from 0.1 to 0.4 mm. Values above 10 GHz will exceed 20 ° and frequencies above 13 GHz will exceed 30 °.