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电子元器件的散热问题,能够影响电子设备的寿命和性能,利用现有的热分析软件,在电子设备的设计阶段,了解其温度分布情况,对设计进行优化,从而提高电子设备的可靠性,本文在电子设备热分析理论的基础上,结合热分析软件的特点,对建模情况、导热情况、对流情况等影响分析结果的因素进行了简要的问题,最后结合Icepak热分析软件,对电子设备热分析中如何利用软件对温度进行控制进行介绍,希望能给实际的电子设备热分析提供一定的参考。
Electronic components of the heat problem, can affect the life and performance of electronic equipment, the use of existing thermal analysis software in the electronic equipment design phase, understand the temperature distribution, the design is optimized to improve the reliability of electronic equipment, Based on the thermal analysis theory of electronic equipment and the characteristics of thermal analysis software, this paper briefly discusses the factors influencing the analysis results, such as modeling, thermal conductivity and convection conditions. Finally, combining the Icepak thermal analysis software, How to use the software to control the temperature is introduced in the thermal analysis, hoping to provide some reference to the actual thermal analysis of electronic equipment.