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分析了工业级和宇航级FPGA在封装结构上的差别,采用Ansysworkbench有限元软件分析了这两种封装器件在随机振动和冲击载荷下的等效应力。结果表明,工业级FPGA在随机振动和冲击载荷下,等效应力均远小于Sn063Pb37焊球材料抗剪强度,具有足够的安全余量。宇航级FPGA在垂直设备安装面方向的随机振动和冲击载荷下,最大等效应力均已超过90Pb10Sn焊柱材料抗剪强度,对其采取加固措施是必要的。
The difference between industrial grade and aerospace grade FPGAs in package structure is analyzed. The equivalent stress of these two kinds of package devices under random vibration and impact load is analyzed by Ansysworkbench finite element software. The results show that the equivalent stress of the industrial FPGA under random vibration and impact load is far less than the shear strength of Sn063Pb37 solder ball material with sufficient safety margin. Under the random vibration and impact load in the direction of vertical equipment mounting plane, the maximum equivalent stress of spaceborne FPGA has exceeded the shear strength of 90Pb10Sn welded column material, so it is necessary to take measures to reinforce it.