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日本的日立研究所成功地发展了这样一种新的复合材料:使纤维状的碳元素复合到铜的基体中,通过调整石墨的混合量,可以在2×10~(-6)～12×10~(-6)/℃的范围内选择它的热膨胀率。这种材料的传热系数比铝优良,若代替铜来制造半导体的电极、基板等,可节约贵金属,具有制造过程简单等优点。由于铜的热膨胀系数是硅的五倍(铜17×10~(-6)/℃硅3.5×10~(-6)/℃)若把铜直接焊到硅上,就会产生变
Hitachi Research Institute in Japan has successfully developed such a new composite material: the fibrous carbon elements into the copper matrix, by adjusting the amount of graphite mixed, you can 2 × 10 -6 -6 × 10 ~ (-6) / ℃ choose its range of thermal expansion. The heat transfer coefficient of this material is better than that of aluminum. If instead of copper is used to fabricate semiconductor electrodes, substrates and the like, it can save precious metals and has the advantages of simple manufacturing process and the like. As the thermal expansion coefficient of copper is five times that of silicon (copper 17 × 10 -6 / ℃ 3.5 × 10 -6 / ℃) If the copper is directly welded to the silicon, it will produce variable