近日,应用材料公司拓展了其Applied Endura Avenir RF PVD系统的应用组合,实现了镍铂合金(NiPt)的沉积,将晶体管触点的制造扩展至22纳米及更小的技术节点。晶体管触点上的高质量镍铂薄膜对于器件性能非常关键,但是在高深宽比(HAR)的轮廓底部沉积材料是一个极大的挑战。为确保触点阻抗的一致性和最佳产品良率,Avenir系统为HAR深达5:1的触孔提供了超过50% Applied Materials recently expanded its portfolio of Applied Endura Avenir RF PVD systems to deposit nickel-platinum alloys (NiPt) that extend the manufacture of transistor contacts to technology nodes of 22 nm and smaller. High quality nickel-platinum films on transistor contacts are critical to device performance, but depositing material at the bottom of a high aspect ratio (HAR) profile is a significant challenge. To ensure consistent contact impedances and best product yield, the Avenir system provides more than 50%