论文部分内容阅读
在美国华盛顿特区举行的1999年度的IEDM会议上,许多论文揭示了集成电路制造技术的最新进展。这些进展可能对于集成电路将来的发展产生重要的影响,至少将有望解决目前面临的一些迫切性问题。例如,采用钢磷HBT器件作成的分频器可以工作在69GHz;采用发光聚合物作成的有源阵列显示屏,有可能解决移动计算机显示屏易于损坏的脆弱性问题;关于栅极氧化层生长均匀性问题的解决则可以提高50um晶体管的可靠性使之达
At the 1999 IEDM meeting in Washington, DC, many papers uncovered the latest advances in integrated circuit manufacturing. These developments may have a significant impact on the future development of integrated circuits, at least will be expected to solve some of the current urgency. For example, dividers with steel-phosphorus HBT devices can operate at 69 GHz; active array displays made of light-emitting polymers have the potential to address the vulnerability of mobile computer displays to damage; Solving the problem can improve the reliability of 50um transistor so that up