用WireBonder(引线键合机)进行键合后的芯片,其焊点可能会出现位置偏移、断线和线尾(Pigtail)过长等缺陷。该文针对上述几种质量问题,利用WireBonder现有的硬件,运用图象处理及模式识别技术,提出了一套自动视觉检测的方法。实验表明,该方法所需硬件低廉,操作方便,能很好地检测WireBonding中焊点的质量。 Bonded chips made with WireBonder may have defects such as misalignment, broken leads, and pigtail length. Aiming at the above several quality problems, this paper presents a set of automatic visual inspection method using the existing hardware of WireBonder, using image processing and pattern recognition technology. Experiments show that the method requires low hardware and convenient operation, and can well detect the quality of the solder joints in WireBonding.