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利用化学气相沉积、光刻和反应离子刻蚀等微细加工技术,可以制作柔性、低成本、结实耐用、生物科技和半导体技术兼容、可重复使用的聚对二甲苯-C荫罩掩膜。利用这种透明的惰性材料掩膜,可以制作出传统平面微加工技术难以实现的曲面微图形,同时在多次使用场合,可以实现其它柔性荫罩掩膜材料难以达到的微米级特征尺寸,并能保持很好的图形复制特性。
The use of microfabrication techniques such as chemical vapor deposition, photolithography and reactive ion etching make flexible, low cost, rugged, biotech and semiconductor compatible, reusable Parylene-C mask masks. With this transparent, inert material mask, curved micrographs that are difficult to achieve with traditional planar micromachining techniques can be made, while micron-scale feature sizes that are otherwise difficult to achieve with other flexible mask mask materials can be achieved in multiple applications Can maintain good graphics replication features.