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采用非等温差示扫描量热法(DSC)研究了两种苯乙炔基封端型聚酰亚胺树脂固化动力学过程,分析了不同升温速率下,两体系的特征固化温度,反应热及反应速率与温度的关系。运用Kissinger法和Melak法进行数据处理。结果表明:(1)苯乙炔封端型聚酰亚胺树脂的固化过程符合n级固化反应方程,建立的固化反应方程较好地描述了其固化过程,且与实验数据拟合结果较好。(2)两树脂体系相比,分子链柔性较大的聚酰亚胺树脂特征固化温度较低,固化温区较宽,固化反应活化能较低,且反应级数较大。
The curing kinetics of two phenylethynyl terminated polyimide resins were studied by non-isothermal differential scanning calorimetry (DSC). The curing temperature, reaction heat and reaction of the two systems were analyzed under different heating rates. Relationship between rate and temperature. Using Kissinger method and Melak method for data processing. The results show that: (1) The curing process of phenylacetylene terminated polyimide resin conforms to the n-stage curing reaction equation. The established curing reaction equation describes the curing process well and fits well with the experimental data. (2) Compared with the two resin systems, the polyimide resin with larger molecular chain flexibility has lower curing temperature, wider curing temperature range, lower curing activation energy and larger reaction order.