论文部分内容阅读
数字微镜器件是由MEMS工艺制成的数字式光反射开关阵列组成,其I/O管脚工作频率高达800 MHz。针对数字微镜器件的对光电两方面性能的严格要求,设计了一种数字微镜器件的封装结构。首先选择倒装封装技术来减小寄生参数,提高器件响应速度;其次优化了板层结构,采用玻璃基底和遮光层来满足光学要求;最后通过对信号完整性和电源完整性问题的仿真设计,满足了电学性能要求,完善了封装基板设计流程。对制作出的微镜器件封装进行测试,在800 MHz的数据频率下,眼图结果与仿真结果较为吻合,降低了封装对信号完整性的影响,达到封装设计要求的指标。
Digital micromirror device is a digital light-reflecting switch array made of MEMS technology. Its I / O pin operates at up to 800 MHz. Aiming at the strict requirements of the digital micromirror device on the performance of both optoelectronic devices, a digital micromirror device package structure is designed. Firstly, flip-chip packaging was chosen to reduce the parasitic parameters and improve the response speed of the device. Secondly, the slab structure was optimized, the glass substrate and light-shielding layer were used to meet the optical requirements. Finally, by simulating the signal integrity and power integrity, Meet the electrical performance requirements, improve the packaging substrate design process. The fabricated micro-mirror device package is tested. At 800 MHz data frequency, the eye diagram results are in good agreement with the simulation results, reducing the impact of the package on the signal integrity and meeting the package design requirements.