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利用飞秒激光直写微纳加工平台,对6H-SiC材料进行了突破衍射极限的微纳结构加工研究.使用中心波长和脉宽分别为800nm和130fs的钛蓝宝石激光器和荧光倒置显微镜搭建了飞秒激光直写微纳加工平台,研究了在不同的实验条件下对6H-SiC的光学加工情况,采用扫描电子显微镜对加工结构进行表征.通过分析不同的激光功率和不同的曝光时间等实验条件下加工的分辨率,发现分辨率随着激光功率的减小而提高,随扫描速度的增大而提高,且能突破光学衍射极限.最终获得125nm的加工线宽,并加工了加工线宽240nm,周期1.0μm的线阵列.研究结果为微机电系统(MEMS)的微器件设计开创了新的思路,对发展MEMS器件具有重要意义.
The micro-nano structure processing of the 6H-SiC material has been studied by using the femtosecond laser direct writing micro-nano processing platform. The Ti-sapphire laser with 800nm and 130fs central wavelength and pulse width of 800nm and the fluorescence inverted microscope S laser direct writing micro-nano processing platform to study the processing of 6H-SiC under different experimental conditions, the use of scanning electron microscopy to characterize the processing structure.Through the analysis of different laser power and different exposure time and other experimental conditions Processing resolution, the resolution is found to increase with decreasing laser power, increasing with the scanning speed, and can break through the optical diffraction limit.Finally, the processing line width of 125nm is obtained and the processing linewidth of 240nm , A period of 1.0μm.The results of the research have opened up a new way of thinking for the micro-device design of microelectromechanical systems (MEMS), which is of great significance for the development of MEMS devices.