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对单晶硅脆性材料的超精密磨削加工作了大量的实验研究。研究结果表明，对于单晶硅等脆性材料，其表面粗糙度主要与砂轮的平均磨粒尺寸、进给量等因素有关。当采用超精密磨床并在Ｖ_ｓ＝１２００ｍ／ｍｉｎ、 ｆ＝０～ ５００μｍ／ｒｅｖ、 ａ_ｐ＝０.１～ １０μμｍ的磨削条件下磨削时，只有当金刚石砂轮的平均磨粒尺寸低于２０μｍ，才能在塑性磨削模式下加工出高质量的光滑表面，其磨削后的表面粗糙度为ｒｍｓ：５．１４ｎｍ、 Ｒａ：３．２５ｎｍ。
A great deal of experimental research has been done on the ultra-precision grinding of monocrystalline silicon brittle materials. The results show that for single-crystal silicon and other brittle materials, the surface roughness is mainly related to the average abrasive grain size, feed rate and other factors. When an ultra-precision grinding machine is used and grinded under grinding conditions of V_s = 1200 m / min, f = 0 to 500 μm / rev and a_p = 0.1 to 10 μm, the average grain size of the diamond grinding wheel is less than 20 μm, In plasticity grinding mode can be processed into high-quality smooth surface, the surface roughness after grinding rms: 5.14nm, Ra: 3.25nm.