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采用实验和有限元模拟，研究了底充胶分层和ＳｎＰｂ焊点的可靠性．结果表明，底充胶分层易发生在芯片／底充胶界面边缘处；当底充胶与芯片粘合强度较弱时，底充胶的早期分层是焊点中裂纹萌生扩展从而导致失效的直接原因；当底完胶与芯片粘合强度较强时．分层可以削弱底充胶对焊点的机械耦合作用，从而影响焊点的热循环寿命，此时，焊点热疲劳裂纹是焊点失效的直接原因。
The experimental and finite element simulation was used to study the reliability of underfill delamination and SnPb solder joints. The results show that the underfill delamination easily occurs at the edge of the chip / underfill interface. When the underfill adhesive is weakly bonded to the chip, the early delamination of the underfill is caused by the crack initiation and propagation in the solder joint resulting in failure The direct cause; when the end of plastic and chip bonding strength strong. Delamination can weaken the mechanical coupling of the underfill to the solder joint, thus affecting the thermal cycle life of the solder joint. At this moment, the thermal fatigue crack of the solder joint is the direct cause of the solder joint failure.