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经信息产业部审查,国家民政部批准,中国半导体行业协会封装分会于2003年10月27日在上海召开成立大会,宣告中国半导体行业协会封装分会正式成立。 我国半导体行业经过几十年的建设,特别是改革开放十多年来,取得了明显的进步,现已发展成为有相当规模、专业门类齐全、品种基本配套的行业体系,但与国际先进水平相比还有较大的差距。在加入WTO的新形势下,面对机遇和挑战,我们要为发展我国的半导体产业而
After review by the Ministry of Information Industry and approved by the Ministry of Civil Affairs, the China Semiconductor Industry Association Packaging Subcommittee held an inaugural meeting in Shanghai on October 27, 2003, announcing that the China Semiconductor Industry Association Packaging Branch was formally established. After decades of development, the semiconductor industry in China has achieved remarkable progress, especially during the more than a decade of reform and opening up. It has now developed into an industry system with a large scale, a complete range of professional categories, and a variety of basic supporting facilities. However, it has reached an international advanced level. There is still a big gap. Under the new situation of accession to the WTO, in the face of opportunities and challenges, we must develop the semiconductor industry in our country.