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The behavior in TC4 alloy was studied and the test were fitted by twice delay function well. At the same time, microstructures observation during stress relaxation were performed by TEM. Results showed that plastic strain rate vs stress dual logarithmic curve was composed of two straight lines in stress relaxation deformation and a critical stress was found. Plastic strain rate stress exponent and microstructure observation showed that stress relaxaton deforming mechnisam is dislocation creep with planar dislocation gliding character at 400 ℃, while recovery creep under the effect of dislocation gliding and climb atom diffusion at 600 ℃.
The behavior in TC4 alloy was studied and the test were fitted by twice delay function well. At the same time, microstructures observation during stress relaxation performed performed by TEM. Results showed that plastic strain rate vs stress dual logarithmic curve was composed of two straight lines in stress relaxation deformation and a critical stress was found. Plastic strain rate stress exponent and microstructure observation showed that stress relaxaton deforming mechnisam is dislocation creep with planar dislocation gliding character at 400 ° C while while recovery creep under the effect of dislocation gliding and climb atom diffusion at 600 ° C.