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研制可用于膜厚检测的系统,获取薄膜反射光谱,基于多层膜反射率模型和非线性回归算法得到厚度分布图。对SOI材料的反射光谱进行测试及分析,结果表明,对于厚度为30μm的顶层硅,其静态重复性为±0.01nm,动态重复性为±1.30nm;对于厚度为2μm的氧化层,其静态重复性为±0.02nm,动态重复性为±1.60nm。该技术还适用于其他集成电路制造工艺中不同材质的膜厚检测。
A system that can be used for the film thickness detection was developed to obtain the film reflection spectra, and the thickness distribution was obtained based on the multilayer film reflectance model and the nonlinear regression algorithm. The reflection spectrum of SOI material was tested and analyzed. The results show that the static repeatability is ± 0.01nm and the dynamic repeatability is ± 1.30nm for the top silicon with the thickness of 30μm. For the oxide layer with the thickness of 2μm, the static repeatability is ± 0.01nm. Sex is ± 0.02nm and dynamic repeatability is ± 1.60nm. The technology is also applicable to the detection of film thickness of different materials in other integrated circuit manufacturing processes.