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阐述了多芯板上芯片(CoB)封装结构,构建了多芯片LED封装模型,将88颗单电极小功率LED芯片直接封装在直径为65 mm的圆形镀铝陶瓷基板上,研制成了一种基于CoB封装技术的自检测LED模组,并使用高低温实验箱对11组样品进行了可靠性试验。高低温实验箱温度设定为85℃,试验周期为1 000 h。试验结果表明:随时间变化多芯片模组的光通量呈下降变化趋势,衰减比例平均变化4.64%,幅度较小,失效数为0;正向电压有上升也有下降,表明该模组具有较高的光转换率,散热性较好,衰减值为-0.25%;相关色温(CCT)在69~205 K内下降,变化比例2.58%。该多芯片LED模组可实现故障芯片自检测,其稳定性和可靠性满足照明灯具指标要求。
The multi-core chip (CoB) package structure is described, and a multi-chip LED package model is constructed. By packaging 88 single-electrode low-power LED chips directly on a circular aluminized ceramic substrate with a diameter of 65 mm, Based on the self-test LED module CoB packaging technology, and the use of high and low temperature test chamber 11 samples were tested for reliability. High and low temperature test chamber temperature is set to 85 ℃, the test period is 1000h. The experimental results show that the luminous flux of multi-chip module decreases with time, the average attenuation rate is 4.64%, the amplitude is small, the number of failures is 0; the forward voltage is increased or decreased, indicating that the module has higher The light conversion rate and heat dissipation were good, with the attenuation value of -0.25%. The CCT decreased from 69 to 205 K, and the change ratio was 2.58%. The multi-chip LED module can achieve fault self-test chip, its stability and reliability to meet the requirements of lighting indicators.