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本文介绍了电子组件的新型的三种组装技术，即板上芯片技术、自动带焊技术和多芯片模块技术．对三种组装技术在工艺和特点方面做了较为详细的论述，并指出了三种组装技术的优缺点
This article describes the new three types of assembly technology for electronic components, namely on-chip technology, automatic tape-bonding technology and multi-chip module technology. The three kinds of assembly technology in the process and characteristics of a more detailed discussion, and pointed out the advantages and disadvantages of the three kinds of assembly technology