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采用封闭式电子回旋共振(MCECR)氩等离子体溅射碳靶的方法在硅片上沉积了高质量的硬碳膜,膜层厚度约40nm. 使用X射线光电子能谱仪(XPS)和高分辨率透射电子显微镜(HRTEM)分析了碳膜结构,并用POD摩擦磨损仪测试了碳膜的摩擦磨损特性,用纳米压入仪测试了碳膜的纳米硬度.详细研究了基片偏压对碳膜的结构、摩擦磨损特性以及纳米硬度的影响,得到了最佳基片偏压.
High-quality hard carbon films were deposited on silicon wafers by closed electron cyclotron resonance (MCECR) argon plasma sputtering of carbon targets with a thickness of about 40 nm.Using X-ray photoelectron spectroscopy (XPS) and high resolution The structure of carbon film was analyzed by transmission electron microscopy (HRTEM), the friction and wear properties of carbon film were tested by POD tribometer, and the nanohardness of carbon film was tested by nanoindenter. The effect of substrate bias on carbon film The structure, friction and wear properties as well as the impact of nano-hardness, the best substrate bias.