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本文用240°e型电子枪做蒸发源,在不同氩压、不同基板偏压时离子镀铝膜。系统地研究了基板偏压和氩压对铝镀层组织形貌的影响。建立了以基板偏压和氩压为变量的组织模型,定名为离子镀V-P组织模型。模型形状表明,在不同氩压下消除锥状晶、柱状晶所需基板偏压不同,氩压大于5×10~(-3)托时,随氩压的增加,消除锥状晶、柱状晶所需基板偏压逐渐降低。氩压小于5×10~(-3)托时,随氩压的降低,消除锥状晶、柱状晶所需基板偏压也逐渐降低,在5×10~(-3)托时存在基板偏压的极大值。作者认为V-P组织三维模型是基板偏压和氩压对铝镀层组织结构综合影响的结果。
In this paper, 240 ° e-type electron gun as the evaporation source, different argon pressure, different substrate bias ion plating aluminum film. The influence of substrate bias and argon pressure on the microstructure of aluminum coating was systematically studied. A tissue model with substrate bias and argon pressure as variables was established and named as ion plating V-P tissue model. The shape of the model shows that the substrate biases needed to eliminate the conical crystals and the columnar crystals are different under different argon pressures. When the argon pressure is greater than 5 × 10 -3 Torr, the conical crystals and the columnar crystals are eliminated with the increase of the argon pressure The required substrate bias is gradually reduced. When argon pressure is less than 5 × 10 ~ (-3) Torr, with the decrease of argon pressure, the substrate bias needed to eliminate the conical crystal and columnar crystal is also gradually decreased. When the pressure is 5 × 10 ~ (-3) The maximum pressure. The author believes that the three-dimensional model of the V-P structure is the result of the combined effect of substrate bias and argon pressure on the microstructure of the aluminum coating.