环氧化合物的光开环聚合一般采用正离子光引发剂,常用的有重氮盐、硫鎓盐和碘鎓盐。它们在光照下产生Lewis酸引发环氧化合物开环聚合,由于Lewis酸对金属有强的腐蚀性,从而限制了它们在光固化涂料的应用。 近年,Hayase等报道了一种新型光引发剂,是由硅醚和有机铝组成,用它固化端基 The ring-opening polymerization of epoxy compounds generally use positive ion photoinitiators, diazonium salts, sulfonium salts and iodonium salts. They produce Lewis acid-initiated ring-opening polymerization of epoxides under light, which limits their use in photocurable coatings due to the strong corrosivity of Lewis acids to the metal. In recent years, Hayase et al reported a new type of photoinitiator, which is composed of silicone ether and organic aluminum, used it to cure end groups