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In the paper homogeneous particleboard of wheat straw is researched. The result shows the technology of homogeneous particleboard from cost and quality. The moisture content of straw particle is 2.0%~2.5 %. The temperature of hot-pressing is 150℃. The time of hot-pressing is 48 sec/mm ( panel thickness). The ratio between MDI and UF is 0.40. The glue content for surface layer of wheat straw particle is 10% (MDI 2.86%, UF 7.14%). The glue content for core layer of wheat straw particle is 8% (MDI 2.29%, UF 5.71%). The panel density is 0.75 g /cm3.
The result shows the technology of homogeneous particleboard from cost and quality. The moisture content of straw particle is from 2.0% to 2.5%. The temperature of hot-pressing is 150 ° C. The time of The ratio between MDI and UF is 0.40. The glue content for surface layer of wheat straw particle is 10% (MDI 2.86%, UF 7.14%). The glue content for core layer of wheat straw particle is 8% (MDI 2.29%, UF 5.71%) The panel density is 0.75 g / cm3.