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本文根据加载激光的工艺参数以及薄膜、基体的材料特性,建立了薄膜与基体的有限元模型,对高斯激光在加载在薄膜表面后的温度场进行有限元模拟,获得膜基系统中温度随时间的变化关系以及薄膜界面结合处的温升规律。并在此基础上根据薄膜和基体的热膨胀性能,进行薄膜和基体的应力场模拟,获得了膜基系统的应力场随时间的变化关系。模拟结果表明：在激光加载过程中,薄膜和基体中的温度场随着时间增加,由于热传导系数的差异在薄膜和基体之间产生温差。在膜基系统中产生的应力场主要集中在薄膜内部,膜基界面结合处产生的应力较大会导致薄膜的脱粘。模拟结果定性地反映了薄膜和基体中温度和热应力的变化规律,为分析激光划痕法的作用过程提供了一定的理论依据,对研究膜基系统失效进程具有重要意义。
In this paper, the finite element model of thin film and matrix is established according to the process parameters of loaded laser and the material properties of thin film and substrate. The temperature field of Gaussian laser after being loaded on the thin film surface is simulated by finite element method, The relationship between the changes and the film at the junction of the law of temperature rise. On the basis of this, the stress fields of the film and matrix are simulated based on the thermal expansion properties of the film and the matrix, and the stress field changes with time of the film-based system are obtained. The simulation results show that during the laser loading process, the temperature field in the thin film and the matrix increases with time, resulting in a temperature difference between the thin film and the substrate due to the difference in thermal conductivity. The stress field generated in the film-based system is mainly concentrated in the interior of the film, and the larger stress generated at the interface of the film-based interface can lead to the debonding of the film. The simulation results qualitatively reflect the changing rules of temperature and thermal stress in thin film and matrix, and provide some theoretical basis for analyzing the action process of laser scribing method, which is of great significance for studying the failure process of film-based system.