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背景及目的微电子和微系统技术的趋势主要表现为：1．微型化至纳米规模。不仅集成电路,而且封装、互联、电路板和系统都在向微型化发展。2．功能集成化。“超越摩尔’’的产品歼发,例如系统级封装、传感器、执行器、和微机电系统(MEMS),推动了功能集成化的高速发展。3．新材料和生态材料的引入。新材料不仪在性能和功能上取得发展,而且还能减少对环境的污染。因而,无铅焊料、绿色化合物等正在高速开发和实现。与此同时,成本的减少,上市和外购时间等因素增加了产品失效的几率和设计的复杂性,因此增加了满足产品质量和可靠性要求的难度。本讲座邀请国际公认的专家,为您提供最尖端的专业知识、微电子和微系统封装领域最新的发展和指南。讲座内容不仅包括先进CMOS发展的全面概述,而且将详细描述封装和装配技术、设计方法、可靠性鉴定测试和预测手段、以及无铅应用方面的最新进展。讲座还将涉及纳米电子在未来发展趋势中的地位。
Background and Objectives Microelectronics and microsystem technology trends mainly as follows: 1. Miniaturization to nanometer scale. Not only integrated circuits, but also packages, interconnects, circuit boards and systems are becoming miniaturized. 2. Function integration. Products such as System-in-Package, Sensors, Actuators, and Micro-Electro-Mechanical Systems (MEMS) propelled the development of “Beyond Moore” products, which led to the rapid development of functional integration.3 The introduction of new materials and eco-materials New materials The performance and function of the instrument to develop, but also reduce environmental pollution.Therefore, lead-free solder, green compounds, etc. are being developed and realized at a high speed.At the same time, the cost reduction, listing and outsourcing time and other factors increased The probability of product failure, and the complexity of the design add to the difficulty of meeting product quality and reliability requirements.This lecture invites internationally recognized experts to provide you with cutting-edge expertise in the latest developments in microelectronic and micro-system packaging And tutorials covering not only a comprehensive overview of advanced CMOS developments but also a detailed description of the latest advances in packaging and assembly techniques, design methods, reliability qualification tests and predictions, and lead-free applications. The lecture will also cover nanoelectronics Future development trend in the position.