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电子元器件引线可焊性,近年来广泛被电子行业所重视。随着整机装配的流水作业化和自动装插技术的采用,一块印制电路板上有成百上千个元器件,在通过波峰焊时要求一次完成。任何焊点的不良都将直接影响到整机的生产效率和可靠性。因此,可焊性的优劣已成为整机厂认定元器件一个重要的质量指标。在电子工业部的领导下,从70年代末到80年代初,元器件引线可焊性课题通过各种渠道组织攻关,几年来在机理研究和生产技术的大量实践中已经有了突破。不但在生产技术上基本过关,而且在引线可焊性质量上,部分产品的技术指标已经达到
Electronic components lead solderability in recent years has been widely valued by the electronics industry. With the whole assembly of assembly line assembly and automatic insertion technology used, a printed circuit board has hundreds of components, when required by wave soldering to complete. Any bad solder joints will have a direct impact on the production efficiency and reliability of the machine. Therefore, the pros and cons of solderability has become an integral part of the machine factory that an important quality indicators. Under the leadership of the Ministry of Electronics Industry, from the late 1970s to the early 1980s, solderability issues of component leads were organized through various channels. Over the past few years, breakthroughs have been made in the extensive practice of mechanism research and production technology. Not only in the basic production technology clearance, but also in the quality of the lead solderability, some of the technical indicators have reached