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多层封装的开发导致了芯片密度和高速信号传输的重大改进。这种多层封装结构可以实现数据传输速度高速100MHz的数百个输入/输出(I/O)互连。为了获得最佳的电性能,封装设计者必须探索能实现高速信号传输的有效设计方法。由于电性能与封装结构材料的选择和结构的外形尺寸有关,设计人员必须加以综合考虑以满足各方面的要求。而且,多层封装结构的成本一般较高,这就要求设计方法能在加工制作之前准确地预测其性能。本文讨论的正是电性能的设计方法,包括计算机辅助设计(CAD)的模型化和模拟。
The development of multilayer packages has led to significant improvements in chip density and high-speed signal transmission. This multi-layer package structure enables hundreds of input / output (I / O) interconnects with high data rates of 100MHz. To get the best electrical performance, package designers must explore efficient design methods that enable high-speed signal transmission. Due to the electrical properties and package structure of the material selection and structure of the external dimensions, designers must be considered together to meet all requirements. Moreover, the cost of multi-layer package structure is generally higher, which requires the design method can accurately predict the performance of the production process. This article discusses the design of electrical properties, including modeling and simulation of computer-aided design (CAD).