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概述了积层绝缘树脂用的去沾污和化学镀铜工艺,可以制造高速信号传输,微细线路和高可靠性的下一代半导体封装基板。
The decontamination and electroless copper plating process for laminated insulating resins is outlined to enable next-generation semiconductor package substrates for high-speed signal transmission, microfabrication and high reliability.