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英飞凌科技股份公司推出采用TO-220 FullPAK封装的第二代SiC(碳化硅)肖特基二极管。新的TO220 FullPak产品系列不仅延续了第二代ThinQ!SiC肖特基二极管的优异电气性能,而且采用全隔离封装,无需使用隔离套管和隔离膜,使安装更加简易、可靠。
Infineon Technologies AG has introduced the second generation SiC (silicon carbide) Schottky diode in the TO-220 FullPAK package. The new TO220 FullPak product family extends the superior electrical performance of the second generation ThinQ! SiC Schottky diodes and is available in a fully isolated package, eliminating the need for bushing and barrier film for easier and more reliable installation.