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两年一次的超大规模集成电路国际会议今年在联邦德国的慕尼黑城举行。会议于8月16日开始,会期三天。来自世界各地的专家、学者参加了会议。这次会议学术水平很高,代表了当今世界各国在超大规模集成电路研究领域的最新发展动向和当今世界的最高水平。会议评审委员会在200多篇论文中选出最好的40篇文章在该会上发表,而且每篇文章都经过6个仲裁的严格审阅,确认文章的质量和技术水平都很高。另外,还有6篇特邀文章。46篇文章的分布是这样的:美国14篇;联邦德国和日本各7篇;英国5篇;法国3篇;荷兰、比利时、澳大利亚各2篇;中国、加拿大、意大利、南朝鲜各1篇。会议的主要内容包括:单元生成;处理器结构,模拟与验证;格式化验证与测试;IC逻辑综合;逻辑与时间优化;语言与协处理器;存贮器和特殊结构;信号处理;布局和布线等。该会与前几届会相比,增加了机电一体化IC和三维芯片结构。
The biennial International Conference of VLSIs was held this year in the Federal Republic of Germany in Munich. The meeting will begin on August 16 with three days’ duration. Experts and scholars from all over the world attended the conference. The high academic level of this conference represents the latest development trends of all countries in the world in VLSI research and the highest level in the world today. The conference review board selected the best 40 papers out of more than 200 papers to publish at the conference, and each article was rigorously reviewed by six arbitrators to confirm the quality and technical sophistication of the articles. In addition, there are 6 articles invited. The distribution of 46 articles is as follows: 14 in the United States; 7 in each of the Federal Republic of Germany and Japan; 5 in the United Kingdom; 3 in France; 2 in the Netherlands, Belgium and Australia; 1 each in China, Canada, Italy and South Korea. The main contents of the conference include: unit generation; processor structure, simulation and verification; format verification and testing; IC logic synthesis; logic and time optimization; language and coprocessor; memory and special structure; signal processing; layout and Wiring and so on. The meeting compared with previous sessions, adding a mechatronic IC and three-dimensional chip structure.